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a study of the current situation and future direction of ic industry in china

2016-11-15

in order to promote the development of china's integrated circuit industry, in september 2014, under the guidance of the ministry of industry and information technology and the ministry of finance, the national integrated circuit industry investment fund (also known as the big fund) was officially established. the fund is considered to carry the mission of supporting chinese enterprises to catch up with europe and the united states in the integrated circuit market.
 
recent investment of large funds
 
ding wenwu, general manager of big fund, made a summary on the investment situation of big fund in the past two years at the annual meeting of china integrated circuit manufacturing held in xiamen. according to him, as of august 31, 2016, the number of national large fund investment enterprises has reached 27, the number of investment projects has reached 37, the investment commitment has exceeded 68.3 billion yuan, and the actual investment has also exceeded 35 billion yuan. the total amount of ic funds set up and to be set up in various localities has exceeded 200 billion yuan.
 
 it covers leading enterprises in various fields, including but not limited to:
 
zhongxin international, shilan micro, changdian technology, huatian, zhanxun, zhongxing microelectronics, guokewei, hexin star, north microelectronics, changchuan, tuojing, shanghai silicon industry, zhongwei semiconductor, sanan optoelectronics, etc.
 
according to the regional distribution, china's ic can be divided into four industrial clusters, namely, the western region, the pearl river delta region, the yangtze river delta region and the bohai rim region.
 
   in addition to domestic investment to support industrial development, foreign m & a is also the focus of china's semiconductor development. according to ding wenwu, in 2015, the global semiconductor m & a investment amounted to us $120 billion, while china's investment reached us $7 billion; while in the first half of 2016, global semiconductor m & a amounted to us $60 billion, and china related m & a also reached us $6 billion.
 
   however, for china semiconductor, there is still a lack of acquisition entities with strong economic strength and international operation experience.
 
the current situation of integrated circuit industry in china
 
ding wenwu said that china's integrated circuit sales have been steadily increasing in the past few years, and the total sales volume in 2015 was as high as 360.98 billion yuan. the sales volume of design, manufacturing and packaging and testing industries were 132 billion, 88.3 billion and 139.4 billion respectively. the proportion of design and manufacturing sectors increased further, and the industrial structure tended to be more balanced.
 
from left to right are the data from 2011 to 2015
 
in the past two years, especially in design and manufacturing, the three important components of integrated circuits: design, manufacturing and packaging test, have achieved a development of up to 26%, which is closely related to the rapid development of china's mobile terminal market and the strong rise of huawei hisense, spreadtrum and smic.
 
as for the sealing and testing industry, in addition to the benefits brought by the previous boom, the acquisition of xingke jinpeng by changdian technology and the multidimensional development of tongfu micro are also important factors.
 
from left to right are design, manufacture and sealing
 
however, contrary to the rapid development, the development of domestic integrated circuits is weak. for example, in 2015, the total value of imports of integrated circuits reached 230.7 billion us dollars, while the total exports were only 69.31 billion us dollars, and the import and export deficit was 161.39 billion us dollars.. this is a great constraint on the independence, security and national defense of the domestic electronic information industry.
 
 according to the data, china's ic industry ranked among the top 10 manufacturers in terms of revenue in design, manufacturing and packaging test in 2015. the rise of domestic manufacturers is obvious to all.

(1) top ten ic design manufacturers in china

in terms of design, thanks to the huge sales of huawei mobile phones and the strong performance of video decoding chips, hisense of huawei is far ahead with the revenue of 22.1 billion yuan, followed by tsinghua ziguang zhanxun. in recent years, its strong performance in 2g / 3g / 4g has firmly ranked second among ic design manufacturers in china.
 
according to statistics from strategy analytics, a market research organization, due to china's huge market, spreadtrum seized 13.5% of the mobile processor market in the first quarter of 2016. compared with the 9.3% market share of last year, the growth trend is obvious, which shows that it is full of momentum.
 
 in the second half of the year, spreadtrum has been making continuous efforts in the smartphone market and constantly seizing the market.
 
top ten ic design enterprises in china in 2015
 
other enterprises on the list have also achieved good results in related fields.
 
 (2) top ten integrated circuit manufacturers in china
 
in terms of manufacturing, smic was slightly ahead of samsung in 2015 and ranked first in revenue. at the same time, china resources microelectronics, huahong hongli, xi'an microelectronics, huali microelectronics and shipboard technology also ranked in the top 10.
 
according to the report of china electronic news, smic has built a relatively complete oem manufacturing platform. from the perspective of process technology, smic has introduced 8 generations of process technologies, including 28nm, 40nm, 65g55nm advanced logic technology, 90nm, 0.13/0.11 μ m, 0.18 μ m, 0.25 μ m, 0.35 μ m mature logic technology, as well as nonvolatile memory, analog / power management, lcd driver ic, cmos mems and other product lines. especially in 28nm technology, smic is still the only pure wafer factory in chinese mainland that can provide 28nm process services to customers. in addition, smic has been developing more advanced 14nm process.
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although smic still has a long way to go compared with tsmc in terms of process technology and competitiveness, smic is good at applying its local industrial chain synergy effect, which is worthy of attention. in april 2016, smic international has become the single largest shareholder of changdian technology. in the future, smic and changdian technology will extend their industrial chain from wafer manufacturing to mid segment bumps and back end sealing and testing, which will not only become the manufacturing leader of domestic semiconductors, but also help to enhance the competitiveness of both parties in the international market.
 
however, at the end of june 2016, smic invested 49 million euros to acquire 70% of the equity of lfoundry, an agent of yidali wafer, which is controlled by lfoundry europe (lfe) and marsica innovation (mi). the acquisition can not only improve smic's joint production capacity, expand the overall technology portfolio, but also help both sides expand market opportunities. that is to say, through this acquisition, the integrated circuit wafer foundry industry in mainland china has successfully set up a multinational production base for the first time, and smic will formally enter the global automotive electronics market with this acquisition. in the later development, the chips were strengthened.

  (3) china's top 10 ic packaging and testing manufacturers

   china's sealing and testing industry has also developed rapidly in the past few years. changdian has merged with xingke jinpeng; tongfu micro power has acquired amd's sealing and testing plants in suzhou and malaysia. this year, it is reported that it will acquire amkor, which ranks second in revenue in 2015. there is also the development of shuitian huatian, and the development of china's sealing and testing industry is also at a high speed.
 
 
jiangsu xinchao technology group, the parent company of changdian technology co., ltd., is no doubt ranked first among the top ten domestic sealing and testing manufacturers. revenue in 2015 was $9.22 billion. the copper bump technology and wafer level chip size packaging technology are the two global patents of changdian. it has the global patent of micro integrated system substrate technology (mis), unique wiring ability, widely used in multi chip and sip integrated qfn, lga, bga packaging. the key technology is to realize fan in and fan out design capabilities on the lead frame package. the small size brings ultra-small and ultra-thin package. it has reached the international advanced level in the aspects of micro integrated system substrate technology (mis) and 25 μ m ultra-thin chip stacking technology, and has a number of independent intellectual property rights. in the future, the company will continue to seek greater breakthroughs in the field of high-density, system integration and micro volume packaging technology.
 
in addition, it is worth mentioning that nantong huada microelectronics group co., ltd., the third largest sealing and testing plant in the world, will be annexed by nantong huada microelectronics group co., ltd.
 
as one of the top three ic packaging and testing enterprises in china, tongfu microelectronics is mainly engaged in integrated circuit packaging and testing business, and has obvious advantages in the field of medium and high-end product packaging and testing, including bga, bga, etc bumping, wlcsp, qfp / lqfp, qfn and power account for about 70% of international customers' income. the products are mainly for intelligent terminals, communication electronics, consumer electronics, automotive electronics, industrial and power devices.
 
with the strong support of the state industrial fund, the company acquired 85% of the shares of amd suzhou and amd penang respectively, and the two sides established joint ventures. amd suzhou and amd penang are mainly used to undertake the internal chip packaging and testing business of amd, to meet the five major cpu post manufacturing processes of cutting, assembling, testing, marking and packaging from semi-finished processor products, so that they have the ability to package and test cpu, gpu and apu at the same time. moreover, amd's advanced flip chip packaging and testing technology complements tongfu microelectronics's advanced flip chip and bump technology, which helps tong fu micro electric master the world-class flip chip packaging and testing technology and enhance its competitiveness.
 
   the future development focus of integrated circuits in china
 
ding wenwu pointed out that the development focus of china's integrated circuit can be summarized into four aspects, namely, focusing on the development of integrated circuit design industry, accelerating the development of integrated circuit manufacturing industry, improving the development level of advanced packaging and testing business, and breaking through the key equipment and materials of integrated circuit.
 
   looking forward to 2020, we will further narrow the gap between china's integrated circuit and the advanced level of the international industry. the average annual growth rate of sales revenue of the whole industry will exceed 20% (reaching trillion yuan), and the sustainable development ability of enterprises will be greatly enhanced. the integrated circuit design technology in key fields such as mobile intelligent terminal, network communication, cloud computing, internet of things and big data will reach the international leading level to form an industrial ecosystem. in terms of packaging and testing, the first step is to realize mass production of 16 / 14nm process, and the packaging and testing technology can reach the international leading level, key equipment and materials can enter the international procurement system, and basically build an advanced, safe and reliable integrated circuit industry
 
(1) attach importance to integrated circuit manufacturing
 
integrated circuit manufacturing is the cornerstone of the industry. without advanced technical support, even a good design can only be a castle in the air. therefore, the state attaches great importance to the development of this field.
 
ding wenwu believes that ic manufacturers should seize the favorable opportunity of technological change. we will break through the bottleneck of investment and financing and continue to promote the construction of advanced production lines. including but not limited to:
 
   a. speed up the expansion of 45 / 40 nm chip production capacity, step up the construction of 32 / 28 nm chip production line, and rapidly form scale productivity
 
   b. accelerate the development of stereo technology, promote the production and construction of 22 / 20nm and 16 / 14nm chips, and develop 10nm.
 
  c, vigorously develop analog and digital analog mixed circuit, mems, high voltage circuit, rf circuit and other special process production lines
 
   d. enhance the comprehensive ability of chip manufacturing, improve the design level with the improvement of process capability, and drive the development of key equipment / materials by the construction of production line.
 
   nsfc has invested in ziguang group, smic international, changdian science and technology co., ltd., and medium and micro semiconductors with investment of rmb 10 billion (quota), hk $3.1 billion, us $300 million and rmb 480 million respectively, with a total scale of about rmb 15 billion. the above four companies basically represent the strongest lineup in the field of semiconductor design, manufacturing, package testing and equipment in china.
 
smic is the largest semiconductor chip manufacturer in china and the fourth largest semiconductor manufacturer in the world after tsmc, samsung, global foundries and umc, with a global market share of about 5-6%. at present, smic's main mass production processes cover from 0.35um to 40nm, and the top three processes of 0.18um, 65nm and 40nm account for 80% of the revenue.
 
however, medium and micro semiconductors are the leading supplier of etcher for semiconductor process core equipment in china. the main products of medium and micro include chip dielectric etching equipment, silicon through-hole etching equipment and movcd. 16 nm chip of medium and micro